Method of fabricating a vertically oriented inductor within interconnect structures and capacitor structure thereof

ABSTRACT

The present disclosure involves a method of fabricating a semiconductor device. The method includes providing a substrate having a horizontal surface. The method includes forming an interconnect structure over the horizontal surface of the substrate. The forming the interconnect structure includes forming an inductor coil that is wound substantially in a vertical plane that is orthogonal to the horizontal surface of the substrate. The forming the interconnect structure includes forming a capacitor disposed proximate to the inductor coil. The capacitor has an anode component and a cathode component. The inductor coil and the capacitor each include a plurality of horizontally extending elongate members.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a divisional of U.S. Utility application Ser.No. 13/212,982 filed Aug. 18, 2011, the entire disclosure of which isincorporated herein by reference.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experienced rapidgrowth. Technological advances in IC materials and design have producedgenerations of ICs where each generation has smaller and more complexcircuits than the previous generation. However, these advances haveincreased the complexity of processing and manufacturing ICs and, forthese advances to be realized, similar developments in IC processing andmanufacturing are needed. In the course of integrated circuit evolution,functional density (i.e., the number of interconnected devices per chiparea) has generally increased while geometry size (i.e., the smallestcomponent (or line) that can be created using a fabrication process) hasdecreased.

Various active or passive electronic components can be formed on asemiconductor IC. For example, transformers, inductors, capacitors, etc,may be formed on a semiconductor IC. However, conventional electroniccomponents formed on an IC may face shortcomings such as excess spaceconsumption, poor device performance, inadequate shielding, and highfabrication costs.

Therefore, while existing electronic components on semiconductor ICshave been generally adequate for their intended purposes, they have notbeen entirely satisfactory in every aspect.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isemphasized that, in accordance with the standard practice in theindustry, various features are not drawn to scale. In fact, thedimensions of the various features may be arbitrarily increased orreduced for clarity of discussion.

FIG. 1A illustrates a perspective view of an inductor device.

FIGS. 1B-1C illustrate a top view and a cross-sectional view of atransformer device.

FIG. 2 is an equivalent circuit schematic of a transformer device.

FIG. 3 is a cross-sectional view of a semiconductor device at a firststage of fabrication.

FIG. 4 is a perspective view of a semiconductor device at a second stageof fabrication and including a semiconductor capacitor according to anembodiment.

FIG. 5 is a perspective view of a transformer device according to anembodiment.

FIG. 6 is a perspective view of a semiconductor device in which thetransformer device of FIG. 5 is implemented according to an embodiment.

FIG. 7 is a perspective view of an inductor capacitor (LC) tankaccording to an embodiment.

FIG. 8 is a perspective view of a capacitor of an LC tank according toan embodiment.

FIG. 9 is a perspective view of a capacitor of an LC tank according toan embodiment.

FIG. 10 is a perspective view of a shielding structure housing atransformer therein according to an embodiment.

FIG. 11 is a perspective view of a shielding structure housing an LCtank therein according to an embodiment.

FIG. 12 is a flowchart illustrating a method of fabricating atransformer device according to an embodiment.

FIG. 13 is a flowchart illustrating a method of fabricating an LC tankdevice according to an embodiment.

FIG. 14 is a flowchart illustrating a method of fabricating a shieldingdevice according to an embodiment.

DETAILED DESCRIPTION

It is understood that the following disclosure provides many differentembodiments, or examples, for implementing different features of variousembodiments. Specific examples of components and arrangements aredescribed below to simplify the present disclosure. These are, ofcourse, merely examples and are not intended to be limiting. Forexample, the formation of a first feature over or on a second feature inthe description that follows may include embodiments in which the firstand second features are formed in direct contact, and may also includeembodiments in which additional features may be formed between the firstand second features, such that the first and second features may not bein direct contact. In addition, the present disclosure may repeatreference numerals and/or letters in the various examples. Thisrepetition is for the purpose of simplicity and clarity and does not initself dictate a relationship between the various embodiments and/orconfigurations discussed.

A transformer is an alternating current (AC) device that transformsvoltages, currents, and impedances. It typically includes two or morecoils coupled magnetically through a common core, for example aferromagnetic core. Faraday's law of electromagnetic inductionestablishes the principle of operation of transformers.

FIG. 1A is a perspective view of an inductor coil 10, and FIG. 1B is atop view of a transformer 20 that includes the inductor coil 10. Thetransformer 20 has a plurality of ports (ports 1-4 as illustratedherein) and includes conductive coils (or windings) that span aplurality of levels. When electric current flows through the conductivecoils, a magnetic field is generated, which is shown in a cross-sectionview in FIG. 1C. Referring to FIG. 1C, the transformer 20 is implementedin an interconnect structure 25 which contains intermetal dielectric(IMD) and metal lines. The interconnect structure 25 is formed on asubstrate 30, which may include a semiconductor material. The electriccurrent flow in the transformer 20 generates a magnetic field 35, whichextends into the substrate 30. According to Faraday's law ofelectromagnetic induction, an eddy current will be induced by thepresence of the magnetic field 35. The eddy current is induced in theinterconnect structure as well as in the substrate 30. Such eddy currentleads to power loss, particularly at high frequencies. Thus, theperformance of the transformer 20 is degraded. In addition, thecoplanar-coupled coils of the transformer 20 as illustrated in FIG. 1Balso entails inefficient use of chip area and a low coupling factor.

In accordance with various aspects of the present disclosure, thefollowing paragraphs will describe a transformer that overcomes theissues associated with the transformer 20. FIG. 2 is a schematic of anequivalent circuit of a transformer device. The transformer deviceincludes a primary coil having ports 1-2 and a secondary coil havingports 3-4. Electrical connections to the primary and secondary coils canbe established through ports 1-4. For example, a voltage V₁ is appliedacross the ports 1 and 2, and a voltage V₂ is induced across the ports 3and 4, which is measured across a load R_(L). A current I₁ is appliedthrough port 1, and a current I₂ is induced at port 3.

R₁ and R₂ represent the winding resistances of the primary and secondarycoils, respectively. The primary coil has N₁ number of windings orturns, and the secondary coil has N₂ number of windings or turns. For anideal transformer (shown in the dashed box FIG. 2 as a device containingthe primary and secondary coils), I₁/I₂=N₂/N₁, V₁/V₂=N₁/N₂, andR₁=(N₁/N₂)²*R_(L).

However, for a non-ideal transformer, the existence of leakage flux,non-infinite inductances, non-zero windings resistance, and the presenceof hysteresis and eddy-current loss need to be taken into account. Forthe transformer illustrated in FIG. 2, X₁ and X₂ represent the leakageinductive reactances of the primary and secondary coils, respectively.R_(C) represents the power loss due to hysteresis and eddy-currenteffects. X_(C) is a non-linear inductive reactance representing thenonlinear magnetization behavior of the ferromagnetic core. Thefollowing paragraphs will describe a transformer having reducededdy-current losses and improved coupling factor according to variousaspects of the present disclosure.

Referring to FIG. 3, a diagrammatic fragmentary cross-sectional sideview of a semiconductor device is illustrated. The semiconductor devicehas a substrate 40. In one embodiment, the substrate 40 is a siliconsubstrate doped with either a P-type dopant such as boron, or doped withan N-type dopant such as arsenic or phosphorous. The substrate 40 may bemade of some other suitable elementary semiconductor, such as diamond orgermanium; a suitable compound semiconductor, such as silicon carbide,indium arsenide, or indium phosphide; or a suitable alloy semiconductor,such as silicon germanium carbide, gallium arsenic phosphide, or galliumindium phosphide. Further, the substrate 40 could include an epitaxiallayer (epi layer), may be strained for performance enhancement, and mayinclude a silicon-on-insulator (SOI) structure.

Although not specifically shown for the sake of simplicity, a pluralityof electronic components may be formed in the substrate. For example,source and drain regions of FET transistor devices may be formed in thesubstrate. The source and drain regions may be formed by one or more ionimplantation or diffusion processes. As another example, isolationstructures such as shallow trench isolation (STI) structures or deeptrench isolation (DTI) structures may be formed in the substrate toprovide isolation for the various electronic components. These isolationstructures may be formed by etching recesses (or trenches) in thesubstrate 40 and thereafter filling the recesses with a dielectricmaterial, such as silicon oxide, silicon nitride, silicon oxy-nitride,fluoride-doped silicate (FSG), and/or a low-k dielectric material knownin the art.

The substrate 40 has an upper surface 50. The surface 50 includes atwo-dimensional plane that is defined by an X-axis and a Y-axis, wherethe X-axis and Y-axis are perpendicular, or orthogonal, to each other.The X-axis and the Y-axis may also be referred to as an X-direction anda Y-direction, respectively.

Referring now to FIG. 4, an interconnect structure 60 is formed over theupper surface 50 of the substrate 40. In other words, the interconnectstructure 60 is disposed over the surface 50 in a Z-axis, or aZ-direction that is perpendicular to the surface 50. The interconnectstructure 60 includes a plurality of patterned dielectric layers andinterconnected conductive layers. These interconnected conductive layersprovide interconnections (e.g., wiring) between circuitries,inputs/outputs, and various doped features formed in the substrate 40.In more detail, the interconnect structure 60 may include a plurality ofinterconnect layers, also referred to as metal layers (e.g., M1, M2, M3,etc). Each of the interconnect layers includes a plurality ofinterconnect features, also referred to as metal lines. The metal linesmay be aluminum interconnect lines or copper interconnect lines, and mayinclude conductive materials such as aluminum, copper, aluminum alloy,copper alloy, aluminum/silicon/copper alloy, titanium, titanium nitride,tantalum, tantalum nitride, tungsten, polysilicon, metal silicide, orcombinations thereof. The metal lines may be formed by a processincluding physical vapor deposition (PVD), chemical vapor deposition(CVD), sputtering, plating, or combinations thereof.

The interconnect structure 60 includes an interlayer dielectric (ILD)that provides isolation between the interconnect layers. The ILD mayinclude a dielectric material such as an oxide material. Theinterconnect structure 60 also includes a plurality of vias/contactsthat provide electrical connections between the different interconnectlayers and/or the features on the substrate. For the sake of simplicity,the metal lines in the interconnect layers, the vias interconnecting themetal lines, and the dielectric material separating them are notspecifically illustrated herein.

According to various aspects of the present disclosure, a transformer isformed in the interconnect structure 60. Or stated differently, variouscomponents of the interconnect structure 60 constitute the transformerdisclosed herein. The transformer is not shown in FIG. 4 for the sake ofsimplicity, but one of its various embodiments is illustrated in moredetail in FIG. 5 and will be discussed in more detail by the followingparagraphs.

Referring now to FIG. 5, a fragmentary perspective view of an embodimentof a transformer 100 is illustrated according to aspects of the presentdisclosure. The transformer 100 includes a coil (or winding) 110 and acoil (or winding) 120. In one embodiment, the coil 110 is a primarycoil, and the coil 120 is a secondary coil. In another embodiment, thecoil 120 is a primary coil, and the coil 110 is a secondary coil. Thecoils 110 and 120 are separated by a dielectric material (e.g., ILD) ofthe interconnect structure 60.

As is the case with any transformer, the coils 110 and 120 each includea plurality of turns or windings. According to aspects of the presentdisclosure, these turns or windings are made up of a plurality ofinterconnect lines and vias of the interconnect structure 60 (shown inFIG. 4). For example, in the illustrated embodiment, the coil 110includes interconnect lines 130-132, which belong to differentinterconnect layers. The interconnect lines 130-132 have elongate shapesand extend horizontally along an axis that is orthogonal to the Z-axis,which could be either the X-axis or the Y-axis. The interconnect lines130-132 also have a width or a lateral dimension 135 that is measuredhorizontally along an axis that is perpendicular to the axis along whichthe interconnect lines 130-132 extend.

The interconnect lines 130 and 131 are interconnected together by viastacks 140 and 141. The interconnect lines 130 and 132 areinterconnected together by via stacks 142 and 143. The via stacks140-143 each extend along the Z-axis each include a plurality ofvertically-aligned (along the Z-axis) vias and interconnect linecomponents.

Similar to the coil 110, the coil 120 also includes a plurality ofelongate interconnect lines that are interconnected by a plurality ofvia stacks. In the illustrated embodiment, the coil 120 includesinterconnect lines 150-156 and via stacks 160-164. The interconnectlines 150-151 are interconnected together by via stack 160. Theinterconnect lines 151-152 are interconnected together by via stack 161(whose view is partially obstructed). The interconnect lines 152-153 areinterconnected together by a via stack whose view is obstructed in FIG.5. The interconnect lines 153-154 are interconnected together by viastack 162. The interconnect lines 154-155 are interconnected together byvia stack 163. The interconnect lines 155-156 are interconnectedtogether by via stack 164.

In comparison to the coil 110, the interconnect lines of the coil 120have substantially narrower widths. For example, the interconnect line150 of the coil 120 has a width 175 that is measured along the same axisas the width 135. The width 135 is greater than the width 175 by afactor that is no less than two. For example, the width 135 may be two,three, or four times the width 175. Due at least in part to the smallerwidth 175, the coil 120 also has more windings or turns than the coil110. Each winding may include its own subset of vertically-alignedinterconnect lines and vias interconnecting these vertically-alignedinterconnect lines. For example, one of these windings of the coil 120includes the interconnect lines 150-151 and the via stack 160, andanother one of these windings includes the interconnect lines 153-154and the via stack 162. These two windings are disposed on planes thatare substantially parallel to each other.

These planes of the windings of the coil 120 define a windingorientation of the coil 120. In a similar manner, the coil 110 also hasa winding that includes the interconnect lines 130-132 and the viastacks 140-143. The winding of the coil 110 is disposed on a plane thatis substantially parallel to the planes of the windings of the coil 120.These plans define a winding orientation or winding direction of thecoils 110 and 120. Thus, it may be said that the coils 110 and 120 eachhave a winding orientation or a winding direction that intersects with(or is non-parallel to) the surface 50 (shown in FIG. 3) of thesubstrate 40. In other words, since the surface 50 is on a plane definedby the X-axis and the Y-axis, the winding orientation of the coils 110and 120 is on a plane that intersects the plane defined by the X and Yaxes. In an embodiment, the plane of the winding orientation of thecoils 110 and 120 is partially defined by the Z-axis, which as discussedabove is perpendicular or orthogonal to both the X axis and the Y axis.

In the illustrated embodiment, the coil 120 is implemented “within” thecoil 110, in the sense that the interconnect lines of the coil 120 aredisposed in interconnect layers that are in between the interconnectlayers in which the interconnect lines of the coil 110 are disposed.Stated differently, the interconnect layers corresponding to the coil110 may include M1 (in which the interconnect line 130 is implemented)and M7 (in which the interconnect line 132 is implemented). On the otherhand, the interconnect layers corresponding to the coil 120 may includeM2-M5, which are disposed in between the interconnect layers M1 and M7,wherein interconnect layers M2-M5 are disposed in between the layers M1and M7. It is understood that these specific layers or numbers of layersare not intended to be limiting, and that the coils 110-120 may beimplemented in other interconnect layers or include different numbers ofinterconnect lines and/or via stacks in alternative embodiments.Furthermore, it is understood that the coil 110 may be implemented“within” the coil 120 in other embodiments.

With reference to FIGS. 2 and 5, the distal portions of the interconnectlines 132 and 131 constitute ports 1 and 2 of the transformer 100,respectively, and the distal portions of the interconnect lines 150 and156 constitute ports 3 and 4 of the transformer 100, respectively.Applying a voltage across ports 1 and 2 will induce a voltage acrossports 3 and 4, and applying a current at port 1 will induce a current atport 3.

Referring to FIG. 6, when the transformer 100 is powered on, a magneticfield 200 is generated by currents flowing through the coil 110. Anothermagnetic field will be induced, and the direction of that inducedmagnetic field is parallel to the magnetic field 200, but opposite. Aportion of the magnetic field 200 is shown in FIG. 6 as broken circularor oval rings. In contrast to the magnetic field 35 (generated by theinductor device) shown in FIG. 1C, the magnetic field 200 issubstantially parallel to the surface 50 of the substrate 40, ratherthan perpendicular to (or otherwise intersect) the substrate 40. Andsince the magnetic field 200 and an induced magnetic field aresubstantially parallel to the surface 50, eddy current will be inducedin the dielectric material of the interconnect structure 60. Little tono eddy current will be induced in the substrate 40. As such, themagnetic interaction between the coils 110-120 and the substrate 40 canbe reduced, thereby resulting in a lower loss in the substrate.

Whereas transformers such as the transformer 20 of FIG. 1B can bereferred to as having coplanar coils, the transformer 100 of FIG. 5 hasvertically-wound coils and can be referred to as a vertically-orientedtransformer. Stated differently, the coils 110-120 of the transformer120 wind in a direction or orientation that is non-parallel to thesurface 50 of the substrate 40. The transformer 100 also has variablemetal width coils. For example, the width of the coil 110 can be severaltimes greater than the width of the coil 120. Such verticalvariable-width transformer of the present disclosure offers advantagesover conventional transformers, it being understood that otherembodiments may offer different advantages, and that no particularadvantage is required for all embodiments.

One advantage offered by the transformer of the present disclosure isreduced consumption in chip area. As seen in FIG. 1B, a transformersimilar to the transformer 20 and having lateral windings will demand asignificant amount of chip area. In comparison, the transformer 100implements its windings vertically. The coils are implemented with metallines belonging to different metal layers interconnected together byvias. As such, the coils wind vertically, in planes orientedperpendicular to the surface of the substrate. The utilization ofvertical space inside the interconnect structure reduces the need forthe coils to occupy space horizontally. Therefore, valuable chip areacan be conserved.

Another advantage offered by the transformer of the present disclosureis reduced losses in the substrate. In conventional transformers havinglateral coil windings, the induced magnetic field is perpendicular tothe substrate, which induces eddy currents in the substrate as well. Thepresence of eddy currents in the substrate results in loss in thesubstrate, which is undesirable. In comparison, for the transformerdisclosed herein, the induced magnetic field is parallel to thesubstrate surface due to the vertical orientation of the coil windings.The parallel magnetic field in turn induces eddy currents that aresubstantially confined within the interconnect structure (and not in thesubstrate). Consequently, loss in the substrate can be substantiallyprevented or reduced.

Another advantage offered by the transformer of the present disclosureis its high impedance transformation. In conventional transformershaving lateral coil windings, the primary coil and the secondary coiltypically has a 1:1 turn ratio. The widths of the primary windings andthe secondary windings are typically the same too. Thus, the inducedcurrent and voltage at the secondary coil is substantially the same asthe current and voltage at the primary coil. In other words, theconventional transformer has very little “step up” or “step down”capabilities, and impedance transformation ratio may be close to 1:1.

In comparison, the variable metal width transformer of the presentdisclosure can have a secondary coil with a plurality of windingscorresponding to each winding of the primary coil. This means that thecurrent at the primary coil can be a plurality of times of the currentat the secondary coil. In addition, the reduced width of the secondarycoil increases the resistance of the secondary coil relative to theprimary coil, which in turn also reduces the current at the secondarycoil relative to the primary coil. Thus, the impedance transformationratio may be much higher than conventional transformer devices.

To illustrate the discussions above, Table 1 below is used as anexample.

TABLE 1 Electrical Conventional Transformer Parameters Transformerdisclosed herein Current I₁/I₂ = (1 * 1)/1 I₁/I₂ = (2 * 3)/1 VoltageV₁/V₂ = 1/(1 * 1) V₁/V₂ = 1/(2 * 3) Impedance Z₁/Z₂ = [1/(1 * 1)]² Z₁/Z₂= [1/(2 * 3)]²

In the transformer correspond to Table 1, the secondary coil has doublethe number of windings as the primary coil (i.e., two turns for eachturn of the primary coil). This results in a transformation ratio of 2.The secondary coil also has a metal width that is ⅓ of the metal widthof the primary coil. This results in a transformation ratio of 3. Hence,whereas a conventional transformer may have a current transformationratio of 1:1, the transformer herein can have a current transformationratio of I₁/I₂=2*3:1 or 6:1. Similarly, whereas a conventionaltransformer may have a voltage transformation ratio of 1:1, thetransformer herein can have a voltage transformation ratio ofV₁/V₂=1:2*3 or 1:6. Since impedance Z=V/I, the impedance transformationratio is effectively squared. In other words, whereas a conventionaltransformer may have an impedance transformation ratio of 1:1, thetransformer herein can have an impedance transformation ratio ofZ₁/Z₂=[1/(2*3)]² or 1:36. As such, to achieve a Z₂ of 108 ohms, Z₁ canbe as low as 3 ohms.

Conversely, the primary coil and the secondary coil can be swapped tohave a reverse transformation ratio, as shown in Table 2 below.

TABLE 2 Electrical Conventional Transformer Parameters Transformerdisclosed herein Current I₁/I₂ = 1/(1 * 1) I₁/I₂ = 1/(2 * 3) VoltageV₁/V₂ = (1 * 1)/1 V₁/V₂ = (2 * 3)/1 Impedance Z₁/Z₂ = [1* 1)/1]² Z₁/Z₂ =[2 * 3)/1]²

The numbers of Table 1 and Table 2 represent the case of an idealtransformer. In a real world situation, the transformer may experiencelower coupling factors due to losses and other concerns such as spacing.For example, for conventional transformers, the primary coil and thesecondary coil may be implemented in a manner such that they are severalmetal layers apart, thereby resulting in a reduced coupling factor. Incomparison, with reference to FIG. 5, the primary coil and the secondarycoil can be adjacent to each other. For example, interconnect line 132of the coil 110 and the interconnect line 150 of the coil 120 are onlyone metal layer apart (i.e., the interconnect line 132 can be in the M6layer, and the interconnect line 150 can be in the M5 layer immediatelybelow the M6 layer). As such, stronger coupling can exist between thecoils 110 and 120, thereby leading to an improved coupling factorcompared to traditional transformers.

Another advantage offered by the transformer disclosed herein is itssuitable usage in high frequency applications. The reduced losses in thesubstrate lead to a higher quality factor, which is important inhigh-frequency applications. Also, the metal widths can be adjusted in asuitable manner so as to operate the primary and secondary coils in adesired resonant frequency, which may be important in microwave circuitdesigns. Furthermore, the capability to step up or down the impedance bya high ratio is also desirable in high frequency applications.

According to various aspects of the present disclosure, thevertically-oriented coils discussed above with reference to FIG. 5 mayalso be used to implement other microelectronic components, for exampleinductor devices. Inductor devices have been widely used in circuitdesigns, for example as part of an inductor-capacitor (LC) tank. LCtanks may be used to implement circuit components such as avoltage-controlled oscillator (VCO). Conventional inductor devices beentypically been implemented using laterally-oriented coils, which asdiscussed above tend to have excessive chip area consumption. Asminiaturization of the IC devices continues, efficient utilization ofchip area becomes more important. Moreover, the relatively long lengthof the coils may lead to higher electrical parasitics, which reduces thequality factor of the LC tank and is therefore undesirable.

The present disclosure discloses an inductor device that substantiallyovercomes the problems discussed above. Referring to FIG. 7, afragmentary perspective view of an LC tank 300 is illustrated. The LCtank 300 is implemented within the interconnect structure 60 of FIG. 4.The LC tank 300 includes an inductor device 310 and a capacitor device320. The inductor device 310 and the capacitor device 320 may beelectrically coupled, for example in parallel or in series.

In the illustrated embodiment, the inductor device 310 includesinterconnect lines 340-344 and via stacks 350-353. The interconnectlines 340-344 may each be implemented in an interconnect layer. In someembodiments, some of the interconnect lines 340-344 may be implementedin the same interconnect layer (for example, interconnect lines 341 and343 may be implemented in the same interconnect layer). The via stacks350-353 each include a plurality of vertically-aligned vias andconductive components.

The interconnect lines 340-341 are interconnected together by the viastack 350. The interconnect lines 341-342 are interconnected together bythe via stack 351. The interconnect lines 342-343 are interconnectedtogether by the via stack 352. The interconnect lines 343-344 areinterconnected together by the via stack 353. A dielectric material (forexample, ILD) otherwise separates these interconnect lines 340-344 andvias 350-354. The interconnect lines 340-344 and the via stacks 350-353collectively make up the coil of the inductor device 310.

Port 1 of the inductor device 310 is defined by a distal end portion ofthe interconnect line 340, and port 2 of the inductor device 310 isdefined by a distal end portion of the interconnect line 344. Anelectrical signal can propagate from port 1 to port (or vice versa)through the interconnect lines 340-344 and the via stacks 350-353. Theinductance of the inductor device 310 may be adjusted by changing itsnumber of coil windings or its material composition.

Similar to the coils of the transformer 100 discussed above (shown inFIG. 5), the inductor device 310 has a winding orientation or directionthat intersects with the surface 50 of the substrate 40 (shown in FIG.3). In other words, the coil of the inductor device 310 winds in anorientation that is non-parallel to the surface 50 of the substrate 40.In an embodiment, the winding orientation of the coil of the inductordevice 310 is approximately perpendicular or orthogonal to the surface50 of the substrate 40. Therefore, for reasons similar to thosediscussed above with reference to the transformer device 100, thevertical orientation of the inductor device 310 creates a magnetic fieldthat is parallel to the surface 50 of the substrate 40, which induceseddy current mostly in the interconnect structure 60, rather in thesubstrate 40. Hence, the inductor device 310 has reduced loss in thesubstrate as well.

The capacitor device 320 includes an anode component 410 and a cathodecomponent 420. The anode component 410 and the cathode component 420respectively serve as anode and cathode terminals of the capacitordevice 320, so that an electrical voltage can be applied through theanode and cathode terminals. Stated differently, when the capacitordevice 320 is in operation (functioning as a capacitor), one voltagewill be applied throughout the anode component 410, while a differentvoltage will be applied throughout the cathode component 420. The anodeand cathode components 410 and 420 may be considered opposite electrodesor may be said to have different polarities. It is also understood thatthe relative positioning of the anode and cathode components 410 and 420is not critical. For example, the anode and cathode components 410 and420 may be rotated, flipped, or switched in other embodiments.

The dielectric material of the interconnect structure 60 serves as thedielectric between the anode and cathode electrodes of the capacitordevice 320. In FIG. 7, the dielectric material separates andelectrically isolates the various parts of the anode component 410 fromthe various parts of the cathode component 420. Depending on the needand function to be performed by the capacitor device 320, the dielectricmaterial of the interconnect structure 100 can be carefully chosen so asto effect the desired capacitance. For example, the capacitance for aparallel plate capacitor can be calculated with the following equation:

$C = {ɛ_{r}ɛ_{0}\frac{A}{d}}$where C is the capacitance; A is the area of overlap of the two plates;∈_(r) is the dielectric constant of the material between the plates; ∈₀is the electric constant (∈₀≈8.854×10−12 F m⁻¹); and d is the separationbetween the plates. As such, if a high capacitance capacitor is desired,the dielectric material of the interconnect structure can be chosen tohave a high dielectric constant.

In the embodiment illustrated in FIG. 7, the anode component 410includes a plate structure 440 and a laterally extending member 450 thatis coupled to the plate structure 440, and the cathode component 420includes a plate structure 460 and a laterally extending member 470 thatis coupled to the plate structure 460. It is understood that the platestructures 440 and 460 may be schematic representations of stacks ofmetal lines and vias, rather than actual single plates. In anembodiment, the laterally extending members 450 and 570 are implementedas interconnect lines in the same or different interconnect layers.

In an embodiment, the members 450 and 470 are substantially parallel tothe surface 50 of the substrate 40. The members 450 and 470 also extendin a direction that is non-parallel to the direction in which theinterconnect lines 340-344 extend. Stated differently, the members 450and 470 each directionally intersect the interconnect lines 340-344,though no physical contact is made. In an embodiment, the members 450and 470 are each substantially perpendicular to the interconnect lines340-344. In an embodiment, the members 450 and 470 are also disposedwithin or in between the interconnect lines 340-344. For example, in theillustrated embodiment, the interconnect lines 340, 342, and 344 arelocated in an interconnect layer above the interconnect layer or layersin which the members 450 and 470 are located, and the interconnect lines341 and 343 are located in an interconnect layer below the interconnectlayer or layers in which the members 450 and 470 are located. It may besaid that the inductor device 310 and the capacitor device 320 areinterdigitated with one another.

FIG. 8 is a perspective view of another embodiment of the capacitordevice 320 of FIG. 7. In FIG. 8, the capacitor device 320A includes ananode component 410A and a cathode component 420A. The anode component410A includes a plurality of laterally extending elongate members 450A,and the cathode component 420A includes a plurality of laterallyextending elongate members 470A. In an embodiment, the elongate members450A and 470A extend in a plane substantially parallel to the surface 50of the substrate 40. The elongate members 450A and 470A may belong to aplurality of different metal layers of the interconnect structure 60. Inthe embodiment shown, these elongate members 450A are interdigitated inthe Y-direction with the elongate members 470A so as to increaseeffective capacitance.

FIG. 9 is a perspective view of another embodiment of the capacitordevice 320 of FIG. 7. In FIG. 9, the capacitor device 320B includes ananode component 410B and a cathode component 420B. The anode component410B includes a plurality of laterally extending elongate members 450B,and the cathode component 420B includes a plurality of laterallyextending elongate members 470B. In an embodiment, the elongate members450B and 470B extend in a plane substantially parallel to the surface 50of the substrate 40. The elongate members 450B and 470B may belong to aplurality of different metal layers of the interconnect structure 60. Inthe embodiment shown, these elongate members 450B are interdigitated inthe Z-direction with the elongate members 470B so as to increaseeffective capacitance.

It is understood that the capacitor device 320 may be implementeddifferently in other embodiments. For example, the capacitor device 320may be implemented using interdigitated structures as detailed in U.S.patent application Ser. No. 13/158,044, Titled “A VERTICALINTERDIGITATED SEMICONDUCTOR CAPACITOR” and filed on Jun. 10, 2011, thecontent of which is hereby incorporated by reference in its entirety. Insome other embodiments, another capacitor device may be implemented as aFinFET varactor having a metal gate.

The inductor device and the LC tank incorporating the inductor device ofthe present disclosure offer advantages over conventional inductors andconventional LC tanks. It is understood that other embodiments may offerdifferent advantages, and that no particular advantage is required forall embodiments. One advantage offered by the inductor device is reducedloss in the substrate. As discussed above, the vertically-oriented (withrespect to the surface 50 of the substrate 40) coils of the inductordevice herein results in a magnetic field that is substantially parallelto the substrate, which induces eddy currents mostly in the interconnectstructure 60, rather than in the substrate 40. Hence, the inductordevice of the present disclosure is less lossy compared to conventionallaterally-oriented inductor devices.

Another advantage offered by the inductor device of the presentdisclosure is less consumption of chip area. Since the coils of theinductor device herein winds vertically, the windings (each spanningseveral metal layers) can be located adjacent to one another. The usageof vertical space results in a more efficient utilization of valuablechip area.

Yet another advantage offered by the inductor device with stripshielding (as shown in FIG. 11 later) of the present disclosure is lowerthermal noise. Due at least in part to the vertical coil windings, theinductor device herein can achieve the same inductance value as aconventional inductor while using a shorter length coil. The shorterlength coil leads to a lower parasitic resistance value of the inductor.The lower resistance value reduces thermal noise, which is correlated to4KTR, where K is Boltzmann's constant, T is a resistor's absolutetemperature in Kelvins, and R is the resistor's resistance value inohms. Therefore, the inductor device herein can achieve a lower thermalnoise than conventional inductor devices. In addition, the reducedparasitic resistance increases the quality factor of the inductor deviceas well.

A further advantage offered by the LC tank with strip shielding (asshown in FIG. 11 later) is more precise resonant frequency adjustment.The LC tank disclosed herein defines the return path clearly. Theinductance values of the inductor device can be flexibly adjusted bychanging its windings. The resonant frequency of an LC tank iscorrelated to the inverse of the square root of (inductance ofinductor×capacitance of capacitor). Thus, the flexibility of inductanceadjustment means that the resonant frequency can be flexibility tuned aswell. This may also reduce silicon tape-out time, which reducesfabrication costs and reduces time-to-market delays.

In order to reduce noise and interference, electronic components such asthe transformer device and the LC tank device discussed above may beshielded using a shielding structure according to the presentdisclosure. Referring to FIG. 10, a fragmentary perspective view of ashielding structure 500 is illustrated. The shielding structure 500 isimplemented within the interconnect structure 60. The shieldingstructure 500 includes side portions 510 and 520. The side portions510-520 are parallel to each other in the illustrated embodiment. Thoughthey are shown as solid blocks, it is understood that the side portions510-520 may each include a plurality of laterally extending interconnectlines interconnected together by vias.

The shielding structure 500 also includes a plurality of conductivemembers (also referred to as strip shielding lines) 530. The conductivemembers 530 extend in a direction that is different from the sideportions 510-520. In an embodiment, the conductive members 530 aresubstantially parallel to the surface 50 of the substrate 40 and aresubstantially perpendicular to the side portions 510-520. According tosome embodiments, the conductive members 530 may be implemented withinterconnect lines of the interconnect structure 60.

In an embodiment, the conductive members 530 couple theoppositely-facing side portions 510-520 together. The conductive members530 each have a width 540. In an embodiment, the width 540 is in a rangefrom about 0.05 microns (um) to about 10 um. The conductive members 530are separated from adjacent conductive members by a spacing 550. In anembodiment, the spacing 550 is in a range from about 0.05 um to about 10um. It is understood, however, that the minimum value can vary dependingfrom the different technology node used.

The shielding structure 500 houses an electronic device 600 therein. Inthe illustrated embodiment, the electronic device 600 is a transformerdevice. In accordance with various aspects of the present disclosurediscussed above, the transformer device 600 includes vertically-windingcoils 610 and 620. The coils 610 and 620 each include interconnect linesfrom different interconnect layers. The conductive members 530 of theshielding structure extend in a direction that intersects with thedirection in which the interconnect lines of the coils 610-620 extend.In an embodiment, the conductive members 530 and the interconnect linesof the coils 610-620 extend in directions that are perpendicular to eachother.

A subset of the conductive members 530 is located in an interconnectlayer above the coils 610-620, a subset of the conductive of theconductive members 530 is located in an interconnect layer below thecoils 610-620. In that manner, the transformer device 600 is surroundedby the shielding structure 500. In addition, a subset of the conductivemembers 530 extends through openings formed by the coils 610 and 620.For example, conductive member 530A is located in an interconnect layerthat is between the topmost (furthest away from the substrate surface)interconnect line and the bottommost (closest to the substrate surface)interconnect line of the coils 610-620. For example, if the topmostinterconnect lines of the coils 610-620 are located in an M7 layer, andthe bottommost interconnect line of the coils 610-620 are located in anM1 layer, then the conductive member 530A may be located in anyone ofthe layers between an M2 layer and an M6 layer.

The shielding structure 500 creates slow-wave features (or a slow-wavephenomenon), which help increase the immunity of the electronic device(such as the transformer 600) located inside the shielding structure 500against noise and interference signals from surrounding devices. Inother words, the slow-wave features created by the shielding structure500 serve to better isolate the electronic device disposed therein. Ingeneral, a slow-wave phenomenon involves a deceleration of thepropagation of electro-magnetic waves in a guided medium. Suchdeceleration can be achieved by implementing periodical shields toreduce the wavelength in a transmission line. Here, the conductivemembers 530 serve as the periodical shields that help create theslow-wave features. Also recall that the conductive members 530A extendthrough, or are surrounded by, the transformer device 600. The presenceof these conductive members 530 enhances the slow-wave phenomenon,thereby further improving the electrical isolation offered by theshielding structure 500. It is also understood that the fact that theconductive members 530 are perpendicularly disposed with respect to thesignal path (propagating along the coils 610-620, for example) helpsreduce noise from being coupled to the signal paths.

FIG. 11 is a perspective view of an embodiment of the shieldingstructure discussed above. The shielding structure 500A houses anembodiment of the LC tank 300 as the electronic device. The shieldingstructure 500A includes a plurality of elongate conductive members 530Athat extend in a direction perpendicular to that of the signal path ofthe inductor coils. Though not specifically illustrated, the shieldingstructure 500A may also include conductive members that extend through(or between) the coils of the inductor, so that a better slow-waveeffect can be obtained to improve the performance of the shieldingstructure.

Though a transformer and an LC tank are used as an example of theelectronic device 600 disposed inside the shielding structure 500, it isunderstood that other types of electronic devices may be implementedinside the shielding structure 500 in alternative embodiments. Forexample, the electronic device 600 inside the shielding structure 500may include one or more inductors, one or more capacitors, one or moreresistors, one or more transmission lines, or combinations thereof. Inthese alternative embodiments, the conductive members 530 of theshielding structure 500 may be perpendicular to the signal paths of theelectronic devices therein, and a subset of the conductive members 530Amay extend through (rather than above or below) the electronic devices.In this manner, the shielding structure 500 may provide good isolationto the electronic device therein against noise from surroundingstructures.

FIG. 12 illustrates a flowchart of a method 700 for fabricating asemiconductor device that includes a transformer device according tovarious aspects of the present disclosure. It is understood that theFigures discussed herein have been simplified for a better understandingof the inventive concepts of the present disclosure. Accordingly, itshould be noted that additional processes may be provided before,during, and after the method 700, and that some other processes may onlybe briefly described herein. The method 700 includes block 710 in whicha substrate is provided. The substrate has a surface that is defined bya first axis and a second axis that is perpendicular to the first axis.The method 20 includes block 720 in which an interconnect structure isformed over the surface of the substrate. The interconnect structure hasa plurality of conductive lines interconnected by a plurality of vias.The formation of the interconnect structure includes forming atransformer device as a part of the interconnect structure. Thetransformer device includes a first coil and a second coil that eachhave a winding orientation that is defined at least in part by a thirdaxis that is perpendicular to the surface of the substrate.

FIG. 13 illustrates a flowchart of a method 800 for fabricating asemiconductor device that includes an LC tank device according tovarious aspects of the present disclosure. The method 800 includes block810 in which a substrate is provided. The substrate has a surface thatspans in an X direction and a Y direction that is perpendicular to the Xdirection. The method 800 includes block 820 in which an interconnectstructure is formed over the surface of the substrate. The interconnectstructure has a plurality of conductive lines interconnected by aplurality of vias. The interconnect structure is formed to includes aninductor capacitor (LC) tank. The LC tank is formed using a subset ofthe conductive lines and a subset of the vias. The LC tank includes aninductor that has a coil winding orientation that spans at least in partin a Z direction that is perpendicular to the X and Y directions. The LCtank includes a capacitor that has an anode component and a cathodecomponent that is interdigitated with the anode component.

FIG. 14 illustrates a flowchart of a method 900 for fabricating asemiconductor device that includes a shielding structure according tovarious aspects of the present disclosure. The method 900 includes block910 in which a substrate is provided. The method 900 includes block 920in which an electronic device is formed over the substrate. Theelectronic device includes a first member and a second member that isspaced apart from the first member. The method 900 includes block 930 inwhich a shielding structure that surrounds the electronic device. Theshielding structure includes a plurality of elongate strip lines. Atleast a subset of the elongate strip lines is disposed between the firstmember and the second member of the electronic device.

One of the broader forms of the present disclosure involves asemiconductor device. The semiconductor device includes a substratehaving a surface that is defined by a first axis and a second axis thatis perpendicular to the first axis. The semiconductor device includes atransformer disposed over the surface of the substrate. The transformerincludes a first coil and a second coil. The first and second coils haverespective winding orientations that are non-parallel to the surface ofthe substrate.

One of the broader forms of the present disclosure involves asemiconductor device. The semiconductor device includes a substrate thatspans in an X-direction and a Y-direction that is orthogonal to theX-direction. The semiconductor device includes an interconnect structureformed over the substrate in a Z-direction that is orthogonal to boththe X-direction and the Y-direction. The interconnect structure includesa plurality of metal lines interconnected together in the Z-direction bya plurality of vias. The interconnect structure contains a transformerdevice that includes a primary coil and a secondary coil. The primarycoil and the secondary coil are each wound at least partially in theZ-direction.

One of the broader forms of the present disclosure involves a method offabricating a semiconductor device. The method includes providing asubstrate having a surface that is defined by a first axis and a secondaxis that is perpendicular to the first axis. The method includesforming an interconnect structure over the surface of the substrate, theinterconnect structure having a plurality of conductive linesinterconnected by a plurality of vias, wherein the forming theinterconnect structure includes forming a transformer device as a partof the interconnect structure, wherein the transformer device includes afirst coil and a second coil that each have a winding orientation thatis defined at least in part by a third axis that is perpendicular to thesurface of the substrate.

One of the broader forms of the present disclosure involves asemiconductor device. The semiconductor device includes a substratehaving a surface that is defined by an X axis and a Y axis that isperpendicular to the X axis; an inductor disposed over the surface ofthe substrate, the inductor having a winding orientation that is definedat least in part by a Z axis that is perpendicular to the X axis and theY axis; and a capacitor disposed over the substrate and adjacent to theinductor.

One of the broader forms of the present disclosure involves asemiconductor device. The semiconductor device includes a substratehaving a horizontal surface; and an interconnect structure formed overthe horizontal surface of the substrate, the interconnect structureincluding: an inductor coil that is wound substantially in a verticalplane that is orthogonal to the horizontal surface of the substrate; anda capacitor disposed proximate to the inductor coil, the capacitorhaving an anode component and a cathode component; wherein the inductorcoil and the capacitor each include a plurality of horizontallyextending elongate members.

One of the broader forms of the present disclosure involves a method offabricating a semiconductor device. The method includes: providing asubstrate having a surface that spans in an X direction and a Ydirection that is perpendicular to the X direction; and forming aninterconnect structure over the surface of the substrate, theinterconnect structure having a plurality of conductive linesinterconnected by a plurality of vias, wherein the forming theinterconnect structure includes forming an inductor capacitor (LC) tankusing a subset of the conductive lines and a subset of the vias;wherein: the LC tank includes an inductor that is formed to have a coilwinding orientation that spans at least in part in a Z direction that isperpendicular to the X and Y directions; and the LC tank includes acapacitor that is formed to have an anode component and a cathodecomponent that is interdigitated with the anode component.

One of the broader forms of the present disclosure involves asemiconductor device. The semiconductor device includes: a substrate; anelectronic device positioned over the substrate, the electronic deviceincluding an opening; and a shielding device positioned over thesubstrate and surrounding the electronic device, the shielding deviceincluding a plurality of elongate members, a subset of which extendthrough the opening of the electronic device; wherein at least one ofthe electronic device and the shielding device is formed in aninterconnect structure positioned over the substrate.

One of the broader forms of the present disclosure involves asemiconductor device. The semiconductor device includes: a substrate; anelectronic device disposed above the substrate, the electronic deviceincluding an elongate first component and an elongate second componentthat extend in a first direction and a second directions, respectively,the second component being disposed above the second component; and ashielding structure disposed over the substrate and shields theelectronic device therein, the shielding structure including a pluralityof strip lines that each extend in a direction non-parallel to the firstand second directions; wherein: a first subset of strip lines aredisposed below the first component of the electronic device; a secondsubset of strip lines are disposed above the first component of theelectronic device and below the second component of the electronicdevice; and a third subset of strip lines are disposed above the secondcomponent of the electronic device.

One of the broader forms of the present disclosure involves a method offabricating a semiconductor device. The method includes: providing asubstrate; forming an electronic device over the substrate, theelectronic device including a first member and a second member that isspaced apart from the first member; and forming a shielding structurethat surrounds the electronic device, the shielding structure includinga plurality of elongate strip lines; wherein at least a subset of theelongate strip lines are disposed between the first member and thesecond member of the electronic device.

The foregoing has outlined features of several embodiments so that thoseskilled in the art may better understand the detailed description thatfollows. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method of fabricating a semiconductor device,comprising: providing a substrate having a surface that spans in an Xdirection and a Y direction that is perpendicular to the X direction;and forming an interconnect structure over the surface of the substrate,the interconnect structure having a plurality of conductive linesinterconnected by a plurality of vias, wherein the forming theinterconnect structure includes forming an inductor capacitor (LC) tankusing a subset of the conductive lines and a subset of the vias;wherein: the LC tank includes an inductor that is formed to have a coilwinding orientation that at least in part spans a Z direction that isperpendicular to the X and Y directions; the LC tank includes acapacitor that is formed to have an anode component and a cathodecomponent that is interdigitated with the anode component; and theinductor and the capacitor are interdigitated.
 2. The method of claim 1,wherein the forming the LC tank is carried out in a manner such that theconductive lines of the inductor and capacitor each extend in adirection parallel to the surface of the substrate.
 3. The method ofclaim 1, wherein the forming the LC tank is carried out in a manner suchthat the conductive lines of the inductor are perpendicular to theconductive lines of the capacitor.
 4. The method of claim 1, wherein theforming the LC tank is carried out in a manner such that the capacitoris partially surrounded by the inductor.
 5. The method of claim 1,further including forming a shielding structure that surrounds the LCtank, wherein the shielding structure includes a plurality of elongatelines.
 6. A method of fabricating a semiconductor device, comprising:providing a substrate having a horizontal surface; and forming aninterconnect structure over the horizontal surface of the substrate, theforming the interconnect structure including: forming an inductor coilthat is wound substantially in a vertical plane that is orthogonal tothe horizontal surface of the substrate; and forming a capacitordisposed proximate to the inductor coil, the capacitor having an anodecomponent and a cathode component; wherein the inductor coil and thecapacitor each include a plurality of horizontally extending elongatemembers; and wherein: the inductor coil and the capacitor areinterdigitated.
 7. The method of claim 6, wherein the forming theinterconnect structure further includes: forming a plurality of metallines disposed in a plurality of interconnect layers; wherein theelongate members of the inductor coil and the elongate members of thecapacitor each include a respective subset of the metal lines.
 8. Themethod of claim 7, wherein the forming the interconnect structurefurther includes: forming a plurality of via stacks; wherein theinductor coil includes a subset of the via stacks that interconnect theelongate members of the inductor coil together.
 9. The method of claim6, wherein at least some of the elongate members of the capacitor aresurrounded by the inductor coil.
 10. The method of claim 6, wherein theelongate members of the inductor coil are perpendicular to the elongatemembers of the capacitor.
 11. The method of claim 6, wherein theelongate members of the anode component are interdigitated with theelongate members of the cathode component.
 12. A method of fabricating asemiconductor device, comprising: providing a substrate having a surfacethat is defined by a first axis and a second axis that is perpendicularto the first axis; forming an inductor over the surface of thesubstrate, the inductor having a coil that is wound at least in partvertically about a third axis that is perpendicular to the first axisand the second axis; and forming a capacitor over the substrate andadjacent to the inductor; and wherein: the inductor and the capacitorare interdigitated.
 13. The method of claim 12, further comprisingforming an interconnect structure over the surface of the substrate,wherein the inductor and capacitor are disposed within the interconnectstructure.
 14. The method of claim 13, wherein the forming theinterconnect structure further includes forming a plurality ofconductive lines and a plurality of conductive vias, wherein theinductor and the capacitor are each implemented using a respectivesubset of the conductive lines and conductive vias.
 15. The method ofclaim 14, wherein the conductive lines of the inductor are perpendicularto the conductive lines of the capacitor.
 16. The method of claim 12,wherein the inductor has an associated magnetic field that issubstantially parallel to the surface of the substrate.
 17. The methodof claim 12, wherein the surface of the substrate is a horizontalsurface, and the winding orientation of the inductor is a verticalwinding orientation.
 18. The method of claim 12, further comprisingforming a dielectric material that separates the inductor and thecapacitor.
 19. The method of claim 12, further comprising forming ashielding structure that includes a plurality of strip lines, whereinthe inductor and the capacitor are shielded by the shielding structure.